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Terms and Conditions: Microsoldering Services

Effective Date: 29 Nov 2025

1. Introduction and Scope

These terms govern the microsoldering services provided by Bendigo Smartphones. Microsoldering is an advanced board-level repair technique used for motherboards, logic boards, and circuits. It is often employed as a "last resort" attempt for data recovery, water damage correction, or complex component failure.

By engaging us for this service, you acknowledge that you have read, understood, and agreed to these terms.

2. The Nature of the Repair & Risk Acknowledgment

Microsoldering is an intrusive, high-risk process involving high temperatures and exposed circuitry. By proceeding, you explicitly acknowledge the following risks:

  • No Guarantee of Success: We cannot guarantee that the device will be repaired or that data will be recoverable.
  • Risk of Further Damage: In some cases, the stress placed on the motherboard during the repair attempt may cause a partially functional device to stop working entirely (e.g., a device with "no image" may become "no power"). Bendigo Smartphones is not liable if the device is returned in a worse condition than when it was received, provided reasonable care was taken.
  • Loss of Waterproofing: Any water resistance rating the device previously held will be permanently lost.

3. Fees and Charges

  • Non-Refundable Bench Fee: A fee is payable immediately upon booking the device for microsoldering. This fee covers the technician’s time, diagnostics, consumables, and shipping (if applicable). This fee is strictly non-refundable, even if the device is deemed unrepairable or if you choose to cancel the repair after work has commenced.
  • Successful Repair Costs: If the repair is successful, additional costs for components and labour may apply. We will provide a quote for approval before finalizing the repair.
  • Right to Withdraw: If the quoted cost exceeds your expectations, you may decline the additional work. However, the initial Bench Fee remains payable.

4. Data and Privacy

Bendigo Smartphones accepts no responsibility for the loss or corruption of data.

  • Your Responsibility: It is your sole responsibility to back up all data (photos, contacts, files) prior to handing over the device.
  • Privacy: In some cases, devices may need to be unlocked to test functionality. We treat your data in accordance with our Privacy Policy.
  • Data Recovery Targets: If the primary goal of the service is data recovery, a successful repair is defined as the device powering on sufficiently to extract data, regardless of full device functionality.

5. Manufacturer Warranties

Engaging in third-party repair and microsoldering will void any remaining manufacturer warranty (e.g., Apple or Samsung warranty). By proceeding, you confirm that you accept this risk and release Bendigo Smartphones from any liability regarding voided warranties.

6. Service Timelines and Outsourcing

  • Estimates Only: Microsoldering is complex and time-consuming. While we aim to meet estimated turnaround times, delays may occur due to component availability or workload. Bendigo Smartphones is not liable for any loss or inconvenience caused by reasonable delays.
  • Third-Party Specialists: To ensure the highest chance of success, we may utilize trusted third-party microsoldering specialists. You consent to your device being transferred to these authorized contractors.

7. Uncollected Goods

If a device is ready for collection and you fail to pay for or collect it within 60 days of notification, Bendigo Smartphones reserves the right to dispose of the device to recover costs, in accordance with the Australian Consumer Law and Fair Trading Act 2012 (Vic) regarding uncollected goods.

8. Device Ownership

You warrant that you are the legal owner of the device or have the owner's direct permission to authorize repairs. We reserve the right to request proof of ownership.

9. Acceptance

By signing in-store, handing over your device, or paying the Bench Fee, you agree to be bound by these Terms and Conditions.